Recently, the Shandong Provincial Science and Technology Award 2014 was announced. Yantai Longkou City won 4 Provincial Scientific and Technological Progress Awards. The number and quality of awards continued to lead Yantai's counties and cities. Among them, Jungle Aluminum won the first prize for scientific and technological progress.
Last year, the Provincial Department of Science and Technology reformed the science and technology reward system and the number of awards was halved. In the face of this situation, the Jungle Technology Center actively guided enterprises in compiling reward materials to further increase the number of awards and enhance the level of rewards.
Junlin Aluminum won the first prize of provincial high-tech advancement for "high-performance large-size complex section aluminum alloy extrusion molding and application technology" project, which was jointly initiated by Aluminum Corporation and Shandong University and Qingdao Sifang Locomotive & Rolling Stock Co., Ltd. The application technology of large-size, complex-section aluminum profiles on high-speed trains has reached the international advanced level and has now been reported to the Ministry of Science and Technology. It is fully impacting the 2015 National Science and Technology Progress Award.
Cleaning runs throughout the semiconductor manufacturing. The cleaning of semiconductors runs through the entire semiconductor process. From the silicon wafer manufacturing, it is necessary to clean the polished silicon wafer to remove surface contaminants, remove photoresist, wet etching, CVD, etc. in the chip preparation, and then to the final material quality inspection. Every step needs to be cleaned to ensure that the next step is free from impurities and maintain the yield of the product. At the same time, as the chip process continues to shrink, the number of cleanings required is increasing. According to statistics, the number of cleaning processes accounts for one-third of the entire chip manufacturing process, and is an important part of chip manufacturing. Very low surface tension and viscosity, it can be well dispersed and spread into various gaps, with good scouring and wetting cleaning effect.
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