According to the calculation, the global production of thin plastic carrier tape industry in 2016 is 14 billion 270 million meters, and the demand is 14 billion 250 million meters. The Global Master Semiconductor Industry Association ( SIA ) announced that global integrated circuit sales came to $ 3.1 billion in December 2016 , compared with the previous month , up 12.3 % compared with the same period in 2015 . In the fourth quarter of 2016 , integrated circuit sales amounted to $ 9.3 billion , with a quarterly increase of 5.4 % and an increase of 12.3 % in the year . In 2016 , integrated circuit sales amounted to $ 388.9 million , with an unprecedented growth rate of 1.1 per cent . In 2016, the Asia-Pacific plastic belt market was $254 million, North America $28 million, Europe $23 million and other regions $19 million. For years. China's thin plastic carrier tape mainly depends on imports. The plastic belt industry in China will develop rapidly with the production line of pelletizer. Pujiang Yitong Plastic has successfully developed the technology of producing PC Black Conductive Sheet for carrier tape and PC multilayer sheet for carrier tape,ABS Conductive sheet for carrier tape,PS Clear Antitsatic Sheet,PS Conductive Sheet. Our country plastic carrier tape business will be accompanied by the rapid,it will forming a complete industrial chain closed loop. The global plastic carrier tape market will grow to $502 million in 2023, driven by emerging markets and downstream demand. Global plastic thin tape production technology mainly lies in the hands of a few foreign firms, the formation of highly technical monopoly in the global scope. At present, Shenzhen pan Xin electronic heat sealing material new type cover with technology breakthrough, is expected to break the foreign manufacturers of technology and market monopoly. To solve the heat sealing cover tape and different material carrier (PC.PS.PET.ABS) surface by loading different of surface molecular structure, which need different types of cover with supporting the peeling force requirements under reach in the range of 15-20 grams or less, avoid machine generated by peeling force generated excessive beating not caused by adsorption, polishing material production and reduce influence this machine is damaged, the cover tape is in its cover with central reserve components out of space, and make the cutting line During the peeling process, the adhesive film layer is separated along the tailor's line. It needs to peel off the strip with the traditional cover strip, resulting in too much peel force or uneven distribution of conductive molecules in the carrier material, resulting in the problem of throwing or blasting belt on the placement machine. Heat sealing with the tear film and the film between the left fixed depth tear line, because it is easy to tear line between the membrane and membrane separation, both sides of thermal glue with high viscosity 80 grams, you can merge with PC; PS; PET; ABS; PVC; the material production load, not all kinds of different materials with a variety of reproduction heat sealing cover tape, and control the peeling force of 10 grams or less than the current semiconductor rely on the US Japan imported high-end cover tape.